Study on thermal degradation mechanism of heat-resistant epoxy resin modified with carboranes
Abstract
To generate a novel heat-resistant phenolic epoxy resin, carborane containing curing agent (1,7-bis(aminophenylene)meta-carborane) was synthesized and applied to cure the resin. The generated carborane-containing phenolic epoxy resin showed better thermal stability and thermal oxidative stability than carborane free phenolic epoxy resin. And the Lap Shear Strength of bonding samples showed the improved bonding performances. The thermal...
Paper Details
Title
Study on thermal degradation mechanism of heat-resistant epoxy resin modified with carboranes
Published Date
Jun 1, 2020
Volume
176
Pages
109143 - 109143
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