doi.org/10.1109/eptc47984.2019.9026608
Original paper

Stress and Strain Level Evolution and Correlation to Void Migration in Solder Bumps after Various Thermo-mechanical Post Treatments

Keith Newman
7
,Tae-Kyu Lee,Siew Kim Lim
Published: Dec 1, 2019
Paper Fields
Paper Details
Title
Stress and Strain Level Evolution and Correlation to Void Migration in Solder Bumps after Various Thermo-mechanical Post Treatments
DOI
doi.org/10.1109/eptc47984.2019.9026608
Published Date
Dec 1, 2019
© 2026 Pluto Labs All rights reserved.