Electromigration

Intermetallic

Electron backscatter diffraction

Crystallography

Crystal structure

Composite material

Tetragonal crystal system

Chemistry

Metallurgy

Materials science

Scanning electron microscope

Void (composites)

Alloy

Grain boundary

Grain growth

Soldering

Microstructure

Acta Materialia

Electromigration (EM) causes intermetallic and void growth that decreases the reliability and lifetime of solder joints. As a diffusion-controlled pro…

Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints