Noncuring Graphene Thermal Interface Materials for Advanced Electronics

Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring thermal paste, i.e., grease, based on mineral oil with a mixture of graphene and few‐layer graphene flakes as the fillers, is reported. The graphene thermal paste exhibits a distinctive thermal percolation...