doi.org/10.1016/j.applthermaleng.2019.114832

A novel thermal management scheme for 3D-IC chips with multi-cores and high power density

..., Zhaoqin Huang
35
Applied Thermal Engineering6.90
Volume: 168, Pages: 114832 - 114832
Published: Dec 23, 2019
Paper Fields
Paper Details
Title
A novel thermal management scheme for 3D-IC chips with multi-cores and high power density
DOI
doi.org/10.1016/j.applthermaleng.2019.114832
Published Date
Dec 23, 2019
Journal
Applied Thermal Engineering
Volume
168
Pages
114832 - 114832
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