Quality (philosophy)

Quantum mechanics

Lead frame

Process capability index

Process (computing)

Engineering

Philosophy

Reliability engineering

Materials science

Layer (electronics)

Work in process

Operating system

Computer science

Manufacturing engineering

Electronic circuit

Mechanical engineering

Statistical process control

Physics

Nanotechnology

Wire bonding

Semiconductor device

Integrated circuit

Epistemology

Process engineering

Operations management

Artificial intelligence

Engineering drawing

Chip

Consistency (knowledge bases)

Process capability

Electrical engineering

International Journal of Production Research

Wire bonding involves welding multiple gold wires to connect integrated circuits (ICs) to external circuits for power and signal transmission. Poor-quality wire bonding can prevent the IC and the electronic product from functioning effectively. In view of this, we developed a model to assess and control the quality of wire bonding with multiple gold wires from the viewpoints of both process and producers. We first analysed the consistency of wire bonding process performance. The Six Sigma quality index was then used to directly assess the quality of the wire bonding process and thereby examine its relationship with process yield. Furthermore, we derived the upper confidence limit of index QPLl by statistical inference, and used it to develop a testing model to ensure rigorous quality assessment. A real-world application in an IC packaging factory located in the Taichung Science Park, Taiwan, demonstrates the effectiveness of the proposed method.

Testing process quality of wire bonding with multiple gold wires from viewpoint of producers