doi.org/10.1016/j.compositesa.2018.07.023

Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer

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..., Moon J. Kim

Composites Part A Applied Science and Manufacturing8.90

Volume: 113, Pages: 76 - 82

Published: Jul 20, 2018

Paper Fields

Paper Details

Title

Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer

DOI

doi.org/10.1016/j.compositesa.2018.07.023

Published Date

Jul 20, 2018

Journal

Composites Part A Applied Science and Manufacturing

Volume

113

Pages

76 - 82

Notes

History