Electrical engineering

Physics

Thermal management of high-power LEDs

Current (fluid)

Meteorology

Observational error

Mathematics

Temperature measurement

Operating system

Statistics

Engineering

Thermal resistance

Junction temperature

Physical chemistry

Light-emitting diode

Chemistry

Materials science

Thermal

Electronic engineering

Computer science

Transient (computer programming)

Quantum mechanics

Optoelectronics

Steady state (chemistry)

IEEE Photonics Technology Letters

This study developed an LED thermal resistance and thermal interface material evaluation method using LEDs with an internal sensor unit by both steady-state and transient thermal measurements. The problem of the measurement delay time caused by the current switching, which exist in conventional methods can be avoided in both steady-state and transient thermal measurements. Slight error in junction temperature measurement caused by the self-illumination effect can be identified without the current switching issue. The error is compensated in steady-state thermal measurement and is insignificant in transient measurement. Compared with conventional methods, this method uses low-cost equipment, while realizing improved accuracy.

Study of LED Thermal Resistance and TIM Evaluation Using LEDs With Built-in Sensor