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Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting
Volume: 20, Issue: 1, Pages: 386 - 401
Published: Feb 24, 2017
Paper Details
Title
Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting
Published Date
Feb 24, 2017
Volume
20
Issue
1
Pages
386 - 401
Notes
History