Electrical resistivity and conductivity

Voltage

Composite number

Engineering

Materials science

Layer (electronics)

Thin-film transistor

Carbon fibers

Electronic circuit

Transistor

Nanotechnology

Carbon nanotube

Integrated circuit

Composite material

Optoelectronics

Electrical engineering

Japanese Journal of Applied Physics

Carbon nanotubes (CNT) can be an attractive candidate for vertical interconnects (vias) in three-dimensional integrated circuits due to their excellent thermal and electrical properties. To investigate the electrical resistivity of CNT, test vias were fabricated using both a top-down and bottom-up approach. The measured resistivity for the top-down process of 10 mΩ cm is among the better values found in literature. Beside this, the ability to grow CNT directly on single-grain thin-film transistors (SG-TFT) was demonstrated. The electrical performance of the SG-TFT was found not to be influenced by the CNT growth.

Towards the Integration of Carbon Nanotubes as Vias in Monolithic Three-Dimensional Integrated Circuits