Original paper

Grain growth and texture evolution in electroformed copper liners of shaped charges

Volume: 474, Issue: 1-2, Pages: 208 - 213
Published: Feb 1, 2008
Abstract
Electron backscattered Kikuchi patterns (EBSP) and optical microscopy (OM) have been employed to reveal grain growth and texture evolution in electroformed copper liners of shaped charges with ultrafine grains and a strong 〈1 1 0〉 fiber texture, which were annealed at various temperatures. By annealing below 410 °C, the grains grow uniformly and show a normal growth. By annealing at 530 °C, a different growth mode has been observed. The grains...
Paper Details
Title
Grain growth and texture evolution in electroformed copper liners of shaped charges
Published Date
Feb 1, 2008
Volume
474
Issue
1-2
Pages
208 - 213
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