information about Thermal copper pillar bump field

Thermal copper pillar bump

https://www.wikidata.org/wiki/Q7783038
Field Hierarchy
Parent
Chemistry
29.3M papers
Materials science
18.8M papers
Organic chemistry
13M papers
Composite material
8.8M papers
Nanotechnology
4.2M papers
Layer (electronics)
1.4M papers
Adhesive
146k papers
Flip chip
11.4k papers
Current
Thermal copper pillar bump
1,218 papers
Child
Trends