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doi.org/10.1016/j.mtla.2022.101511
Properties of ultrathin molybdenum films for interconnect applications
Valeria Founta
2
,
Jean-Philippe Soulié
11
,
...,
Christoph Adelmann
49
View all 18 authors
Materialia
2.90
Volume: 24, Pages: 101511 - 101511
Published
: Jul 13, 2022
45
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Paper Fields
Electrical engineering
Physics
Nanotechnology
Silicide
Molybdenum
Engineering
Dielectric
Composite material
Thin film
Metallurgy
Materials science
Condensed matter physics
Overlayer
Annealing (glass)
Layer (electronics)
Crystallinity
Grain boundary
Chemical vapor deposition
Electrical resistivity and conductivity
Optoelectronics
Microstructure
Paper Details
Title
Properties of ultrathin molybdenum films for interconnect applications
DOI
doi.org/10.1016/j.mtla.2022.101511
Published Date
Jul 13, 2022
Journal
Materialia
Volume
24
Pages
101511 - 101511
Notes
History
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