doi.org/10.1016/j.optlastec.2022.108323
Original paper

Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes

..., Xunchun Lin
2
Optics & Laser Technology4.60
Volume: 154, Pages: 108323 - 108323
Published: Jun 6, 2022
Paper Fields
Paper Details
Title
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
DOI
doi.org/10.1016/j.optlastec.2022.108323
Published Date
Jun 6, 2022
Journal
Optics & Laser Technology
Volume
154
Pages
108323 - 108323
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