Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
Volume: 305, Pages: 117595 - 117595
Published: Apr 7, 2022
Paper Details
Title
Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
Published Date
Apr 7, 2022
Volume
305
Pages
117595 - 117595
Notes
History