Analysis of a composite piezoelectric semiconductor cylindrical shell under the thermal loading

Volume: 164, Pages: 104153 - 104153
Published: Jan 1, 2022
Abstract
We study the electromechanical and piezotronic behaviors of a composite piezoelectric semiconductor cylindrical shell (CPCS), which consists of a piezoelectric dielectric layer and a non-piezoelectric semiconductor layer, under a uniform temperature loading. A simplified one-dimensional (1D) multi-field coupling model for the CPCS structure is established. The analysis of the tuning effect of the thermal loading as well as the effects of the...
Paper Details
Title
Analysis of a composite piezoelectric semiconductor cylindrical shell under the thermal loading
Published Date
Jan 1, 2022
Volume
164
Pages
104153 - 104153
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