Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints

In this research, cohesive parameters were extracted for Sn-0.7Cu/Cu solder joint failure. Double cantilever beam (DCB) specimens were used to study the fracture of the joint under both mode-I and mixed-mode conditions. A bilinear traction separation law (TSL) was used to capture the failure of the joint. Increasing the bond-line thickness from 110 to 880 µm increased the critical energy release rate for crack initiation (Gci) and maximum...