Liquid Droplet Stamp Transfer Printing
Abstract
Despite the increasingly significant role of flexible electronics in information, energy, and medical treatment, their integration with a special‐shaped interface remains an unresolved challenge. The traditional transfer method, as a core technology of device integration, is still unsuitable for thinned chips and 3D sensors. Solid‐contact elastomer stamp sometimes causes cracks while non‐contact method such as sacrificial layer method fails to...
Paper Details
Title
Liquid Droplet Stamp Transfer Printing
Published Date
Sep 24, 2021
Volume
31
Issue
52
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