High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration

Volume: 225, Pages: 109264 - 109264
Published: Nov 1, 2021
Abstract
To achieve a high thermal conductivity, thermally conductive polymer composites have been recently exploited, focusing on connecting a 3D network of thermally conductive fillers by applying external pressure or constructing a pre-made 3D filler framework to reduce phonon scattering within the polymer matrix. However, these approaches severely restrict the use of polymers, particularly epoxy composites, in many commercial applications such as the...
Paper Details
Title
High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration
Published Date
Nov 1, 2021
Volume
225
Pages
109264 - 109264
Citation AnalysisPro
  • Scinapse’s Top 10 Citation Journals & Affiliations graph reveals the quality and authenticity of citations received by a paper.
  • Discover whether citations have been inflated due to self-citations, or if citations include institutional bias.