Experimental investigation for modeling the hardening of thermosetting polymers during curing

During curing of thermosetting polymers, crosslinking results in hardening or stiffening of the material. In electronics, for example in encapsulating integrated circuits (die bonding), thermosets are fully cured in a controlled environment (under UV-light or within a thermal oven) such that the highest stiffness possible has been achieved. In building materials, specifically in thermosets used in fastening systems (adhesive anchoring),...