Enhanced Thermal Transport across Self‐Interfacing van der Waals Contacts in Flexible Thermal Devices

Volume: 31, Issue: 48
Published: Sep 1, 2021
Abstract
Minimizing the thermal contact resistance (TCR) at the boundary between two bodies in contact is critical in diverse thermal transport devices. Conventional thermal contact methods have several limitations, such as high TCR, low interfacial adhesion, a requirement for high external pressure, and low optical transparency. Here, a self‐interfacing flexible thermal device (STD) that can form robust van der Waals mechanical contact and low‐resistant...
Paper Details
Title
Enhanced Thermal Transport across Self‐Interfacing van der Waals Contacts in Flexible Thermal Devices
Published Date
Sep 1, 2021
Volume
31
Issue
48
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