Improved properties of PTFE composites filled with glass fiber modified by sol–gel method

PTFE/GF(glass fiber) composites are widely applied in high-frequency printed circuit board (PCB) substrate materials due to the excellent dielectric properties of PTFE and the low thermal expansion coefficient of GF. However, the poor interface compatibility between PTFE and GF affects the performance of the composite substrates. In this study, tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was...