Reducing free formaldehyde emission, improvement of thickness swelling and increasing storage stability of novel medium density fiberboard by urea-formaldehyde adhesive modified by phenol derivatives

Volume: 111, Pages: 102962 - 102962
Published: Dec 1, 2021
Abstract
Notwithstanding the enormous benefits of medium density fiberboard, free formaldehyde emission and low water resistance are the significant disadvantages to reducing their application. In this research, phenolic compounds such as phenol, 1,2,4-trihydroxy benzene (hydroxyquinol), and 4-tert-butyl catechol in various amounts were added to an industrial-grade liquid urea-formaldehyde polymer in an attempt to alleviate these defects. Medium density...
Paper Details
Title
Reducing free formaldehyde emission, improvement of thickness swelling and increasing storage stability of novel medium density fiberboard by urea-formaldehyde adhesive modified by phenol derivatives
Published Date
Dec 1, 2021
Volume
111
Pages
102962 - 102962
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