Fabrication of EVA connected 3D BN network for enhancing the thermal conductivity of epoxy composites

Highly thermo-conductive polymer-based composites have attracted extensive attention in the field of electronic and heat exchange. However, it is still challenging to obtain a favorable thermal conductivity enhancement at low filler loading by directly using commercial fillers. Here, a lightweight and mechanically strong 3D hexagonal boron nitride (BN) network is prepared using BN as basic assembly unit. The prepared 3D framework displays a...