Surface integrity analysis of ultra-thin glass molding process
Abstract
Curved ultra-thin glass is widely used in mobile electronic devices such as smartphones, and its market demand is gradually increasing. The ultra-thin glass molding process (UTGMP) is a new type of glass molding process with a short processing period and high precision. However, the UTGMP is restricted to the development of curved ultra-thin glass because of its low pass rate and high cost. In particular, surface defects, including cracks,...
Paper Details
Title
Surface integrity analysis of ultra-thin glass molding process
Published Date
Nov 1, 2021
Journal
Volume
47
Issue
21
Pages
30584 - 30597
Citation AnalysisPro
You’ll need to upgrade your plan to Pro
Looking to understand the true influence of a researcher’s work across journals & affiliations?
- Scinapse’s Top 10 Citation Journals & Affiliations graph reveals the quality and authenticity of citations received by a paper.
- Discover whether citations have been inflated due to self-citations, or if citations include institutional bias.
Notes
History