The estimation of residual stresses by the brittle thin film’s initial cracks on a ductile substrate subjected to tensile stresses

Thin metal films in the nanometer range are extensively used for electronic and optoelectronic devices. However, the residual stress has a profound impact on the durability of the devices during their lifetime. This paper developed a two-dimensional (2D) elastic model to study the residual stress and opening-mode fractures (OMFs) in a film/substrate assembly. The fracture strength expressed by crack length is derived by the strength criterion....