A new reutilization strategy of waste printed circuit board nonmetal powders for constructing superhydrophobic coatings

Reutilization of waste printed circuit board nonmetal powders (WPCBP) has been one of the major bottlenecks in the comprehensive utilization of electronic wastes. Herein, a new reutilization strategy of WPCBP was innovatively proposed to develop a superhydrophobic coating. Typically, WPCBP@SiO 2 hybrid filler was successfully prepared by the in‐situ growth of silica on WPCBP surface, and the structures and compositions of WPCBP@SiO 2 were...