Transient Liquid Phase Bonding of Al-2%Nanoclay Composite: Microstructural Characterization and Mechanical Properties

In this research, transient liquid phase (TLP) bonding method was used to join Al-2%Nanoclay composite, using a Cu interlayer. The samples were bonded for 60 to 240 min at 580 °C. Microstructural evaluations showed that the bond line was widened by increment in holding time due to dissolution of joint zone and base material. However, bond width decreased in 240-min sample due to the completion of isothermal solidification and subsequent...