Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology

The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid–solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond...