Determining thermo-mechanical stress sources of an integrated optical device

In this study, we analyze the thermo-mechanical behavior of a multi-functional integrated optical chip (MIOC) via the finite element method (FEM). MIOC is a kind of fiber optic component which has a high thermal sensitivity. So; during temperature changes its mechanical resistance has a considerable critical significance. To investigate the thermo-mechanical effects, a three-dimensional device structure is modeled and time-dependent Von-Mises...