Nanopore engineered tortuosity towards thermo-mechanically enhanced low-k polymer-mesoporous organosilica composite membranes

The continuous development of microelectronics requires mechanically enhanced insulating materials with a lower dielectric (low-k) constant. To accomplish this, in this paper, low-k polymer nanocomposites were reinforced with hydrophobic ethane-bridged mesoporous organosilica (EMO) particles as fillers. In this study, three types of EMOs such as pure EMO, EMO functionalized with trimethoxyphenylsilane (PTS) (EMO-PTS) group, and EMO...