Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements
Abstract
In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the...
Paper Details
Title
Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements
Published Date
May 29, 2021
Journal
Volume
12
Issue
6
Pages
632 - 632
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