Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal expansion (CTE), and high thermal conductivity, but electrical insulation properties are largely demanded in the higher power electric devices. However, micro-fillers have a positive effect on maintaining the good flowability of epoxy composites, while do not bring high thermal conductivity enhancement per unit mass. While nano-fillers with high specific...