Preparation and sintering characteristics of nanosilver-tin core–shell paste

Nanosilver paste, an interconnect solder, is a common choice in the electronic packaging industry; however, higher sintering temperatures and lower sintering strength limit its application. At present, core–shell nanoslurry has been studied and applied to chip interconnection. Based on the mechanism of heterogeneous flocculation, we have developed a new nanosilver wrapped tin paste (Sn@Ag paste), and according to the decomposition temperature of...