Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing

Chip peeling-off, mainly accomplished through the cooperation of needle-ejecting and vacuum-absorbing, plays a critical role in chip transferring process. However, there are few studies involving the quantification of process parameters, such as optimal needle position, needle force or displacement, to access to a reliable chip peeling. In this paper, optimization criteria for a high success rate of thin chip peeling-off are presented. With the...