Fracture toughness of thermoelectric materials

Volume: 144, Pages: 100607 - 100607
Published: Apr 1, 2021
Abstract
The engineering applications of thermoelectric (TE) devices require TE materials possessing high TE performance and robust mechanical properties. Research on thermal and electrical transport properties of TE materials has made significant progress during the last two decades, developing TE materials on the threshold of commercial applications. However, research on mechanical strength and toughness has lagged behind, restricting application of TE...
Paper Details
Title
Fracture toughness of thermoelectric materials
Published Date
Apr 1, 2021
Volume
144
Pages
100607 - 100607
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