Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

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Volume: 187, Pages: 110121 - 110121
Published: May 1, 2021
Abstract
In the past years, the use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. In the latest version of this alloy, manganese, and bismuth are used to improve further its soldering parameters. In this study, a reliability issue, the whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 solder alloys was investigated. Ultra-thin films (in 100–150 nm thickness) were vacuum evaporated...
Paper Details
Title
Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers
Published Date
May 1, 2021
Journal
Volume
187
Pages
110121 - 110121
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