Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

This review compares the mechanical and thermal-electrical properties of sintered copper (Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications. Sintered Cu is explored as a possible replacement for sintered Ag, which suffered from electrochemical migration and high cost. However, sintered Cu faces severe oxidation throughout its product lifecycle, from Cu particle synthesis to joint formation, and...