Investigation of Crystallographic Aspects of Subsurface Damage Induced by Grinding Using Micro-Raman Tomographic Imaging

The objective of this study is to propose and develop an evaluation method on the process damages of sapphire wafers, regarding crystallographic aspects of the damages by use of tomographic imaging techniques with laser Raman microscopy (called as micro Raman tomographic imaging: mRTI). In this paper, tomographic images with the peak width and the shift of the peak position were observed with mRTI, on c-plane cut sapphire wafers along a-plane,...