A new computational approach for three-dimensional singular stress analysis of interface voids

Volume: 232, Issue: 2, Pages: 639 - 660
Published: Nov 25, 2020
Abstract
Defects in terms of three-dimensional voids are commonly encountered at bi-material interfaces. In the current study, the singular stress field near the circumferential corner line of a three-dimensional axisymmetric interfacial void is analyzed using our newly established singular interface edge elements. Under the premise that null null null null null null null null null null null null null null null null null null null null null null null...
Paper Details
Title
A new computational approach for three-dimensional singular stress analysis of interface voids
Published Date
Nov 25, 2020
Volume
232
Issue
2
Pages
639 - 660
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