Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

2,2′‐Dithiobisethanamine (cystamine), an aliphatic diamine containing exchangeable disulfide bonds, was used as the curing agent for epoxy resin. The dynamic curing kinetics and thermal stability of the epoxy/cystamine system were investigated by DSC and TGA analysis. Applied the Málek method, the Sestak–Berggren autocatalytic equation was selected to describe the cure kinetics of the epoxy/cystamine system. The results showed that the Šesták–...