Copper phthalocyanine buffer interlayer film incorporated in paper substrates for printed circuit boards and dielectric applications in flexible electronics

Volume: 172, Pages: 107898 - 107898
Published: Oct 1, 2020
Abstract
In this work, the use of sublimated copper phthalocyanine (CuPc) organic thin films as a buffer interlayer in aluminum tracks on paper is presented for the first time. The CuPc was synthetized using a new eco-friendly synthetic protocol and the higher purity of the product turn out to be useful for the set forth applications. With the use of the CuPc buffer interlayer it is possible to enable paper substrates as printed circuit boards and as...
Paper Details
Title
Copper phthalocyanine buffer interlayer film incorporated in paper substrates for printed circuit boards and dielectric applications in flexible electronics
Published Date
Oct 1, 2020
Volume
172
Pages
107898 - 107898
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