Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling
Published: Jul 1, 2020
Abstract
Lead free electronic assemblies are often subjected to thermal cycling during qualification testing or during actual use. During the dwells at the constant high temperature extreme, the lead free solders joints will experience thermal aging phenomena, resulting in microstructural evolution and material property degradation. Additional aging effects can also occur in the ramp periods from low to high temperature.In this study, we have...
Paper Details
Title
Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling
Published Date
Jul 1, 2020
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