New triepoxy monomer and composites for thermal and corrosion management

The denser and faster componented next‐generation electronic devices produce an increased amount of heat during operations. Thermal dissipation is critical to the performance, lifetime, and reliability of electronic devices. With emerging of new applications such as three‐dimensional chip stack architectures, flexible electronics, and light‐emitting diodes, thermal dissipation becomes a challenging problem. In this study, a new resole‐based...