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doi.org/10.1016/j.msea.2019.138026
Dislocation structure evolution under electroplastic effect
Siqi Xiang
11
,
Xinfang Zhang
19
View all 2 authors
Materials Science and Engineering A
7.00
Volume: 761, Pages: 138026 - 138026
Published
: Jun 12, 2019
178
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Paper Fields
Joule heating
Physics
Electron
Dislocation creep
Philosophy
Strain rate
Dislocation
Composite material
Flow stress
Materials science
Stress (linguistics)
Condensed matter physics
Linguistics
Quantum mechanics
Plasticity
Peierls stress
Paper Details
Title
Dislocation structure evolution under electroplastic effect
DOI
doi.org/10.1016/j.msea.2019.138026
Published Date
Jun 12, 2019
Journal
Materials Science and Engineering A
Volume
761
Pages
138026 - 138026
Notes
History
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