Liquid metal

Computer science

Interconnection

Engineering

Composite material

Electrical contacts

Nanotechnology

Composite number

Electronics

Materials science

Stretchable electronics

Carbon nanotube

Electrical engineering

Computer network

Nano Letters

The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for rigid structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites ca...

Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement