Curing mechanism of alkoxysilyl-functionalized epoxy(II): Effect of catalyst on the epoxy chemistry

Alkoxysilyl-functionalized epoxy composites were recently reported to offer the ultra-low thermal expansion properties as low as 3–4 ppm/°C at 85 wt% of silica, not normally achievable with conventional epoxy systems. Understanding the curing mechanism of alkoxysilyl-functionalized epoxies is necessary for future applications, especially in semiconductor packaging. For this purpose, the distinctive chemistry of the alkoxysilyl-functionalized...