Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part I – adhesive creep data

This two-part paper presents measurements and modelling of creep deformation at relatively low stress of two epoxy adhesives used in opto-electronic applications, one having a relatively high modulus and the other a low modulus. Part I describes the bulk tensile creep tests at various temperatures (75–95 °C) and stress levels representative of those in opto-electronic devices. A novel laser-based method of non-contact creep strain measurement...