Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part II – Joint measurements and FEA

The creep deformation of two glass-epoxy adhesive joints, representative of joint designs used in opto-electronic devices, was measured at various temperatures and relatively low stress levels using a novel, ultra-sensitive method employing optical interference fringes. The adhesive creep models obtained in Part I were then used as the constitutive equations in finite element models of the joints with the objective of assessing the accuracy of...