Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy

Volume: 147, Pages: 81 - 94
Published: Jul 1, 2018
Abstract
For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)3-EOCN) was synthesized using the...
Paper Details
Title
Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy
Published Date
Jul 1, 2018
Journal
Volume
147
Pages
81 - 94
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